No-Clean Lead-Free Soldering Flux Paste SMD PCB Repair
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- High Activity Rosin Can Help To Remove The Oxide Layer On The Welding Surface Easily
- Product Advantages: Pushing-Type Design Smoother Flowing No Wasting During Welding
- Low Residue: No Clean Solder Wick, As Only a Small Amount of Residue is Left After Use, Saving You Time On Cleaning
- Lead-Free, Halogen Free, Excellent Wetting, Non-Corrosive, Good Flow Ability
- Applications: Widely Used in Circuit Board, lC, BGA /SMD Circuit Board,Motors, Lighting,TV and OtherHousehold Appliances And industrial Equipment,Sensors, Wires, Fuses, Phone,Metal Shells, Motors,Lighting, connectors,SMT Maintenance
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Select a product to estimate shipping.Need to repair small circuit boards or electronics? SoPagre’s No-Clean Lead-Free Soldering Flux Paste is designed for precision work, offering a smooth and efficient soldering experience. This paste helps remove oxide layers for optimal solder flow and minimizes residue.
Key Highlights
- Easy Oxide Removal: The high activity rosin formula quickly removes oxidation from the welding surface.
- Smooth Flowing: The pushing-type design ensures a consistent and even flow of flux during soldering.
- Reduced Waste: Minimizes material waste due to its controlled flow, making it efficient for small repairs.
- Low Residue: Leaves minimal residue after use, reducing the time needed for post-soldering cleaning.
- Excellent Wetting: Provides superior wetting properties for strong solder joints.
Useful Facts
- Manufacturer: SoPagre
- Item Weight: 3.2 ounces (92g)
- Dimensions: 7.6 x 5.04 x 1.26 inches
- Quantity: 1 Set (1 tube of solder paste)
- First Available: April 2, 2026
Good Fit For
- Circuit board repair and maintenance
- Electronics repair (ICs, motors, lighting, TVs)
- SMT (Surface Mount Technology) work
- DIY electronics projects
- General household appliance repair
Product details






| Main Specification | |
|---|---|
| Fabricant | SoPagre |
| Marque | SoPagre |
| Article Quantité de colis | 1 |
| Composantes incluses | 1 Set Solder Paste |
| Source d'énergie | alimenté à la main |
| Poids de l'article | 3,2 onces |
| Product information | |
| Dimensions de l'emballage | 7.6 x 5.04 x 1.26 inches |
| Numéro du modèle | MN-019 |
| Others | |
| Date de première disponibilité | 2026 or April 2 |
| Type de produit | Soldering Flux |









